Tashan TS-F Fingertip Tactile Sensor

Fingertip tactile unit built on Tashan's self-developed AI tactile chip (TS3F605AQ) and curved-capacitive sensing — designed to perceive contact force, position and material, and already shipping into automotive OEM programs; the tactile lineage behind BrainCo's TS-F+ hand.

QuoteFingertip-format tactile priced per channel count and integration config · figures indicative · EXW China
Type3-axis fingertip tactile
CoreAI tactile chip (TS3F605AQ)
SensingCurved-capacitive, multi-dimensional
ModalitiesForce · position · material
Price bandQuote
MOQ1 unit
Lead time4–8 wks
Warranty12 mo
Last verified: 2026-07† Manufacturer-reported, not yet independently verified.

Full specifications

Last verified: 2026-07
MECHANICAL
FormFingertip-format tactile unit
Sensing principleCurved-capacitive (tomographic) tactile
PERFORMANCE
ModalitiesNormal + tangential force, contact position, material recognition, proximity
Signal chainOn-chip AI tactile parsing (TS3F605AQ + SNN algorithms, maker-stated)
INTERFACE
OutputDigital serial (chip-level; confirm bus per integration)
COMMERCIAL
Price bandPOA
MOQ1 unit

† Manufacturer-reported, not yet independently verified.

Fits with

Confirmed and manufacturer-claimed platform compatibility. We check your exact wrist and communication setup before quoting.

Dexterous-hand fingertips (integration engagement)Electronic-skin patches for grippers and end-effectors

Supplier

Tashan Technology 北京他山科技有限公司Self-reported
Beijing · est. 2017

AI tactile-sensing chip and sensor developer. Its mixed-signal AI tactile chip lets sensors perceive 3D force, deformation, temperature and texture, targeting humanoid robots, automotive and consumer electronics. Backed by research teams from Tsinghua University and the University of Manchester.

View profile

Downloads

Datasheet (PDF)
available after supplier authorization

FAQ

Is TS-F a drop-in sensor or an integration project?

It is a chip-anchored tactile unit typically integrated into a fingertip or skin assembly rather than a standalone plug-and-play probe. Scope your mechanical and firmware integration with the supplier before committing.

What can it actually sense?

The maker describes multi-dimensional contact — normal and tangential force, contact location, proximity and material characteristics — parsed on the AI tactile chip. Treat published capability claims as unverified until you bench-test.

Is this related to the BrainCo hand's tactile?

BrainCo markets a 'TS-F+' multi-modal tactile package; the TS-F name and chip originate with Tashan. Confirm the exact module and firmware version on any RFQ.

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